12.21.2024

Cutting Edge of AI Hardware for 2025


An amazing presentation of the Latest AI Hardware Innovations.

Artificial intelligence is transforming the world, and the demand for faster, more efficient, and scalable hardware to support AI workloads has never been greater. From deep learning inference to running massive language models, AI hardware companies are pushing boundaries with novel technologies. In this blog post, we’ll explore some of the most exciting developments in AI hardware, highlighting innovations from IBM, Etched, Lightmatter, Apple, Groq, SambaNova, and Cerebras. These groundbreaking advancements are shaping the future of AI computing, with promises of faster performance, greater efficiency, and revolutionary designs.


IBM's Analog Hybrid AI Chip

IBM's Hermes: Digital Meets Analog for Energy-Efficient AI

IBM’s Hermes chip represents a bold step forward in AI hardware by combining digital circuits with phase-change memory (PCM). This hybrid approach enables Hermes to perform deep learning inference with remarkable efficiency. IBM claims that their analog AI chips are up to 14 times more energy-efficient than traditional all-digital devices.

According to a research paper published in Nature Electronics, matrix-vector multiplication (one of the main workloads for AI inferencing) could be performed directly on chip-stored weights. By performing these operations directly on chip-stored weights, it can significantly reduce the need for data movement between memory and processing units, which is often a bottleneck in traditional computing architectures. This approach can lead to faster processing times and lower energy consumption, making it particularly beneficial for AI inferencing tasks.


IBM Hermes AI Chip Overview

The integration of PCM allows Hermes to process data in an analog manner, mimicking the brain’s efficiency in handling tasks. This is particularly exciting for edge devices and scenarios where power consumption is a critical factor. With Hermes, IBM is paving the way for energy-conscious AI that doesn’t compromise on performance.



Sohu is an AI Transformer On-A-Chip

Etched’s Sohu: Transforming AI with Application-Specific Chips

Etched’s Sohu chip is a game-changer for large language models (LLMs). Designed as an application-specific integrated circuit (ASIC), the Sohu chip far-outperforms even Nvidia's cutting-edge H100 GPUs in AI inference. A single 8xSohu server delivers performance equivalent to 160 H100 GPUs(!)


Etched describes the Sohu as an “AI transformer on a chip,” meaning it’s application design is specifically for a specific transformer-based architecture. This architecture would change depending on the AI model. Etched specifically mentions the Llama 70 Billion Parameter LLM model. The architecture-on-a-chip focus allows it to handle LLM inference with unparalleled speed and efficiency.



Lightmatter's Light Chips are built different

Lightmatter's Photo Processors: AI at the Speed of Light

Lightmatter, a spinout from MIT, is revolutionizing AI hardware with its Photon Processors. These chips use light, rather than electricity, for communication between processors on servers. By leveraging analog calculations and optical data transfer, Lightmatter’s processors run 1.5 to 10 times faster than Nvidia’s A100 GPUs.


“The two problems we are solving are ‘How do chips talk?’ and ‘How do you do these [AI] calculations?’, “With our first two products, Envise and Passage, we’re addressing both of those questions.” - Lightmatter CEO Nicholas Harris PhD


In addition to their speed, Lightmatter’s Photon Processors integrate seamlessly with popular AI frameworks like PyTorch and TensorFlow, making them accessible to developers. The use of photonic technology reduces latency and power consumption, offering a glimpse into a future where light-based computing becomes mainstream in AI.



Apple M4 Chip with 2 Memory Modules

Apple’s M4 Processor: Unified Memory for AI Power

Apple continues to innovate in AI hardware with its new M4 Processor. This chip combines a CPU, GPU, and Neural Processing Unit (NPU) into a unified architecture with shared memory. The Unified Memory design enables the M4 to offer significantly higher memory capacity (128GB Combined) compared to current GPUs like Nvidia’s 4090 and the upcoming 5090 (set to release in early 2025 with 32GB of VRAM).


Apple’s approach prioritizes efficiency and integration, making the M4 a powerful tool for both AI and general-purpose computing. The ability to share memory across components reduces bottlenecks and makes the M4 particularly suited for tasks like AI training and inference on consumer devices.


Make no mistake, Intel, AMD, Qualcomm, and Nvidia are also integrating AI into their PC chips.



Groq Company (& SambaNova) creates speed with AI chips


Groq and SambaNova AI Chips: Ultra-Low Latency at Scale

The GroqChip Processor is designed for ultra-low-latency, scalable AI performance. With 16 chip-to-chip interconnects, GroqChip allows seamless communication between chips without the need for additional switches or CPUs. This design ensures low-latency performance at scale, making it ideal for real-time AI applications.


Key specifications of the GroqChip include:

  • 80 TB/s on-die memory bandwidth and 230 MB of on-die memory for high-speed access to model parameters.
  • 750 TOPs (Tera Operations Per Second) and 188 TFLOPs (INT8, FP16) performance.
  • Integration of PCIe Gen4 and RealScale™ chip-to-chip interconnects for scalable solutions.
  • Groq’s focus on scalability and low-latency performance positions it as a leader in AI hardware for data centers and enterprise applications.


SambaNova's SN40L AI Chip

SambaNova, a competitor to Groq, offers the Reconfigurable Dataflow Unit (RDU) AI Chip.

"Built for Agentic AI", The combination of the large addressable memory and the dataflow architecture of the RDU result in a system that is significantly faster than other processors for model inference, shown by the multiple world records. While other processors can only perform inference, the SambaNova RDU is capable of model training and inference on a single system.



Behold: Cerebras Wafer-Scale AI Chip

Cerebras WSE-3: The World’s Largest AI Processor

Cerebras’ WSE-3 (Wafer-Scale Engine 3) is a marvel of engineering, boasting the title of the fastest AI processor on Earth. This third-generation chip contains 900,000 AI cores on a single wafer, offering unprecedented performance for AI workloads.


What sets the WSE-3 apart is its massive on-chip memory:

44GB of SRAM, evenly distributed across the chip, allows for single-clock-cycle access to memory.

21 PB/s memory bandwidth and 214 Pb/s processor interconnect bandwidth eliminate the communication bottlenecks typical of traditional multi-chip systems.

The WSE-3’s design allows it to handle massive AI models with ease, providing 880x more capacity and 7,000x greater bandwidth than leading GPUs. Cerebras is redefining what’s possible in AI infrastructure, making it easier to train and deploy state-of-the-art models.



Innovations in AI Hardware

The innovations discussed above represent a shift in AI hardware design. From energy-efficient analog chips to wafer-scale processors and photonic communication, these advancements are addressing some of the biggest challenges in AI computing:


Energy Efficiency: IBM’s Hermes and Lightmatter’s Photon Processors highlight the importance of reducing power consumption without sacrificing performance.

Scalability: GroqChip and Cerebras WSE-3 demonstrate new approaches to scaling AI infrastructure with low-latency, high-bandwidth designs.

Specialization: Etched’s Sohu chip shows the potential of application-specific designs optimized for transformer-based AI workloads.

Integration: Apple’s M4 Processor underscores the value of unified architectures that simplify AI development and deployment.

As AI models grow in complexity and demand, these hardware innovations will play a crucial role in unlocking the next generation of AI applications. Whether it’s training massive LLMs, deploying AI at the edge, or enabling real-time inference, the future of AI is being built on these cutting-edge chips.


2025 is on the horizon

As 2025 shows over the horizon, AI hardware is scaling up, and many companies are taking a unique approaches to solving the challenges of AI processing and accelerating. With advancements in analog computing, light processors, and wafer-scale integration, the future of AI hardware is bright—and incredibly fast. As these technologies mature, we can expect AI to become even more powerful, efficient, and accessible, driving innovation across industries. Stay tuned, because the next leap in AI might just arrive on the back of one of these groundbreaking chips.


#Accelerate



Sources: 

IBM Touts Analog-Digital Hybrid Chip for AI Inferencing

IBM Research Inference Chip Performance Results Released

Sohu AI chip claimed to run models 20x faster and cheaper than Nvidia H100 GPUs

Startup accelerates progress toward light-speed computing

Apple Moves to M4 Chip to Power New MacPros and iMacs

The Wafer Scale Engine 3 Is A Door Opener

SambaNova RDU: The GPU Alternative


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